Automotive engineering is currently undergoing a significant change: purely mechanical systems are gradually being replaced by mechatronic and electronic systems. This change in technology is accompanied by a need for new processes and services in both manufacturing and remanufacturing. As sensitive electronic systems have to be protected from influences such as mechanical and thermal stress, corrosion or electrostatical effects, the printed circuit boards (PCBs) are sealed with silicone gels or ep¬oxy resins. For repairing or remanufacturing the circuit boards these sealants have to be removed. The process for removing the sealants has to be quick, residue-free, non-destructive and economic. This describes one example of the many challenges which will face the remanufacturing industry in the future. The eCleanER (electronic component cleaning engineering for remanufacturing) project has been established by the Chair Manufacturing and Remanufacturing Technology, part of the Fraunhofer Processinnovation project together with leading partners from research and industry. It was started in March 2013 and aims to develop processes and define the conditions for cleaning electronic components. For more details, please go to the external weblink.